大会主席

Co-Chair

• Gang Chen
  Professor
  Mechanical Engineering Department
  Massachusetts Institute of Technology
  77 Massachusetts Ave., 3-260
  Cambridge, MA 02139
  Tel: 617-253-0006
  Fax: 617-258-5802
  gchen2@mit.edu

• Liding Wang
  Academician of Chinese Academy of Sciences, China
  Professor of Dalian University of Technology, China
  School of Mechanical Engineering, Dalian University of Technology, Dalian, 116023, P. R. China
  Tel: 86-411-84708917
  Fax: 86-411-84708940
  wangld@dlut.edu.cn

• Robert Warrington
  Dean, College of Engineering
  Room 701 Minerals & Materials Bldg.
  Michigan Technological University
  1400 Townsend Drive
  Houghton, MI 49931-1295
  Phone: 906 487 2005
  Fax: 906 487-2782
  row@mtu.edu

• Xianfan Xu
  Professor
  School of Mechanical Engineering
  Purdue University
  West Lafayette, IN 47907
  Phone: (765) 494-5639
  Fax: (765) 494-0539
  xxu@ecn.purdue.edu

委员会

• International Advisory Committee
  
  Yia-Chung Chang, Center of Applied Sciences, Taiwan
  Mildred S. Dresselhaus, MIT, USA
  Jan Dubowski, University of Sherbrooke, Canada
  Jean-Jacque Greffet, Ecole Centrale Paris, France
  Costas P. Grigoropoulos, UC Berkeley, USA
  Zeng-Yuan Guo, Tsinghua University, China
  Chih-Ming Ho, UCLA, USA
  Joon-Sik Lee, Seoul National University, Korea
  Arun Majumdar, UC Berkeley, USA
  Ken Okazaki, Tokyo Institute of Technology, Japan
  Alberto Ortega, National Science Foundation, USA
  Dimos Poulikakos, ETH Zurich, Switzerland
  Frank Trāger, University of Kassel, Germany
  Sishen Xie, Chinese Academy of Science, China
  Shizhu Wen, Tsinghua University, China  

• Technical Program Committee

Ping Cheng, Shanghai JiaoTong University, China
Nicholas X. Fang, University of Illinois, USA
Timothy S. Fisher, Purdue University, USA
Qingan Huang, Southeast University, China
Wenhao Huang, USTC, China
Wen J. Li, Chinese University of Hong Kong, China
Zhuangde Jiang, Xian Jiaotong University, China
Chong Liu, Dalian University of Technology, China
Yungfeng Lu, University of Nebraska-Lincoln, USA
Jianbin Luo, Tsinghua University, China
Boris Luk`yanchuk, Data Storage Institute, Singapore
Hongbin Ma, University of Missouri, USA
Shigeo Maruyama, University of Tokyo, Japan
Pinar Menguc, University of Kentucky, USA
Lining Sun, Ha'erbin Institute of Technology, China
Sebastian Volz, CNRS, France</li>
Xinwei Wang, University of Nebraska, Lincoln
Yuelin Wang, Shanghai Institute of Microsystems, China
Steven Walsh, University of New Mexico, USA
Yimin Xuan, Nanjing University of Science & Technology, China
Ronggui Yang, University of Colorado - Boulder, USA
Bin Yao, Purdue University
Weizhen Yuan, Northwestern Polytechnical University, China
Alice Haixia Zhang, Institute of Microelectronics,
                                       Peking University,China
Ming Zhou, Suzhou Univeristy, China
Dongsheng Zhu, South China University of Technology, China
Ning Gu, Southeast University, China